Samsung Electronics is about to adopt a new processor packaging technique for its high-spec Exynos processors to power the flagship Galaxy S series. According to a report by Hankooki.com, the Korean tech giant is turning toward Fan-Out Wafer-Level Packaging technology for the Exynos 2500 SoC on the Galaxy S25 series. The move aims to enhance the company’s presence in the premium chipset segment.
What Is Fan-Out Wafer-Level Packaging (FOWLP)?
Contrary to package-on-package (PoP) technology, FOWLP is a relatively newer technique used in compact devices such as smartphones. It is a method for packaging several integrated circuits (ICs) onto one silicon wafer before separating into individual chips. Further, tiny wires connect the ICs on the package, enabling communication with other components.
The advantages of FOWLP over the traditional PoP technique include smaller package sizes, resulting in a thinner and lighter chipset. Further, the larger surface area of individual chips leads to better heat distribution, which keeps overheating issues in check. Last but not least, the chipsets developed through this method provide faster data transfer speeds, increasing the overall performance.
Previously, Samsung used the FOWLP technology in its Exynos 2400 SoC. This chipset powers the Galaxy S24 and Galaxy S24 Plus models in several markets, including India. Samsung claimed that the technique increased heat resistance by 23 percent and improved multi-core performance by eight percent on the current generation flagship processor. Hence, the next-generation Exynos chipset could be even better.
What Does This Mean For Samsung’s Exynos Processors?
Per the report, Samsung will use the FOWLP technology on the Exynos 2500 SoC. This chipset will power the Galaxy S25 series, which is expected to come out earlier next year. Further, the report states that the improved heat dissipation results with the Exynos 2400 have gained some confidence and might increase the demand for Exynos chipsets for premium smartphones.
Samsung Wants To Regain The Industry’s Confidence In Its Foundries
However, there’s more to it for the company than it meets the eye. By manufacturing high-quality smartphone chipsets, Samsung not only wants to increase the adoption of Exynos chipsets across the Galaxy S lineup but also wants to entice Qualcomm to consider its foundries for chip production. This would be a mutually beneficial situation for both companies.
In the past, Samsung and Qualcomm collaborated to produce Snapdragon 8 Gen 1. However, due to excessive overheating issues with the chipset, Qualcomm shifted toward TSMC’s foundries for producing Snapdragon 8 Gen 2 and 8 Gen 3. Meanwhile, the company has been struggling to improve the performance of its in-house processor, marketed as Exynos.
The Samsung Galaxy S23 lineup was the first in years to ship without any Exynos chipsets. All the models, including the vanilla Galaxy S23 and Galaxy S23 Ultra, featured the Snapdragon 8 Gen 2 SoC. However, in 2024, Samsung included the Exynos 2400 SoC in the Galaxy S24 and the Galaxy S24 Plus models in some markets, indicating that the company has regained confidence in its manufacturing process.
Is There Any Potential Downside To The FOWLP Technology?
One major downside of FOWLP technology is that it is much more expensive than the regular PoP technique. This is why Samsung will reserve it for its premium Galaxy S lineup. Hence, users shouldn’t expect the FOWLP technology on the mid-range Galaxy A series or entry-level Galaxy M or F series smartphones for the foreseeable future.
In conclusion, Samsung’s long-term goal is establishing Exynos as a viable option for its flagship smartphones. Simultaneously, the company wants to increase its revenue sources by getting Qualcomm to be one of its clients. However, much of this depends on the performance of Exynos 2500.
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