Virtual Reality
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Setting the Stage for HAMR HDDs
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Seagate on Wednesday introduced its Exos X24 family of hard drives, it's highest capacity series of drives to date. The new family is comprised ...

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3nm Production Node Accounts for 6% of Revenue
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Although Taiwan Semiconductor Manufacturing Co. formally started production of chips using its N3 (3nm-class) process technology back in late ...

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144L SLC NVMe Drive for Write-Intensive Workloads
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Solidigm's datacenter SSD offerings have been clearly delineated into different categories - the D3- SATA offerings for legacy servers, the D5- ...

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Samsung Introduces LPCAMM Memory Modules
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Although Low Power DDR(LPDDR) memory has played a pivotal role in reducing PC laptop power usage, the drawback to the mobile-focused memory has ...

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Corsair’s Dominator Titanium Memory Now Available, Unveils Plans for Beyond 8000 MT/s
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Corsair has started sales of its Dominator Titanium memory modules that were formally introduced this May. The new modules bring together ...

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Crucial Unveils X9 Portable SSD: QLC for the Cost-Conscious Consumer
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Crucial entered the portable SSD market relatively late, with their X6 and X8 PSSDs being the mainstay for many years. Based on QLC NAND, they were marketed ...

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A 20 Gbps PSSD for Prosumer Workloads
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Samsung's portable SSD lineup has enjoyed significant market success since the launch of the T1 back in 2015. Despite the release of the ...

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Tenstorrent to Use Samsung’s SF4X for Quasar Low-Cost AI Chiplet
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Tenstorrent this week announced that it had chosen to use Samsung's SF4X (4 nm-class) process technology for its upcoming low-cost, low-power ...

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ASRock Industrial NUC BOX-N97 and GMKtec NucBox G2 Review: Contrasting Compact ADL-N Options
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Intel introduced a separate microarchitecture for low-power / low-cost x86 systems in the 2008 Silverthorne Atom processors. Variation of the ...

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A $179 Graphics Card for 1080p Gaming
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When Intel unveiled its range of Arc A-series desktop graphics cards last year, it introduced four models: the Arc A770, Arc A750, Arc A580, ...

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Importance of Open Innovation Platform Is Growing, Collaboration Needed for Next-Gen Chips
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This year TSMC is commemorating 15 years of its Open Innovation Platform, a multi-faceted program that brings together the foundry's suppliers, ...

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Core i9-13900H in a 4×4 Package
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The performance of ultra-compact form-factor (UCFF) desktops has improved significantly since the introduction of the Intel NUC in the early ...

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